Another common mistake is simply reducing the diameter of the through-holes to permit space to reroute the breakout. To maintain manufacturability, I recommend a minimum 6mil finished hole size/8mil ...

If you want to build cool things these days, you’ve probably had to master surface mount electronics. However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] ...

[Andrew Zonenberg] has crossed a line in his electronic hobby projects. The Ball Grid Array (BGA) is a type of chip footprint which most hobbyists leave to the professionals. But he’s learned the ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

The plastic Ball Grid Array (BGA) and Low profile Fine pitch BGA (LFBGA) packages have developed over recent years from being rarely used devices, to become, for many applications, the first choice ...

Simple and inexpensive semiconductor devices in earlier generations of electronic systems were easily discarded or recycled when they were damaged either before or during the printed circuit board ...

The following paper provides Via Fanout and Trace Routing solutions for various metric pitch Ball Grid Array Packages. Note: the “metric” dimensions are the ruling numbers. To solve the metric pitch ...

Hirose has launched a new ball grid array (BGA) mezzanine connector designed for high-speed data applications, including a version compatible with the COM-HPC standard. The IT18 Series supports ...

BGA’s are the boon and bane of engineers and printed circuit board designers. Their unparalleled pin density and low lead inductance are essential in today’s high-pin count, high-frequency integrated ...

State-of-the-art microfabricated ion traps for quantum information research are approaching nearly one hundred control electrodes. We report here on the development and testing of a new architecture ...