It's not just about small size, weight, power consumption, and cost anymore, as efficient processors, fast data conversion, and optical interconnects help designers look at systems in a whole new way.

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...

Aerospace and defense engineers are under considerable pressure to design and develop, integrate, and upgrade embedded computing systems such that they deliver ever greater capabilities in ever ...