What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

Micron Technology shares are surging on strong demand for its memory chips. Taiwan Semiconductor has charged ahead thanks to ...

The 3D-IC market outlook is entering a decisive phase as the semiconductor industry transitions beyond the limits of traditional Moore’s Law scaling. As performance, power efficiency, and system ...

Wide-bandgap materials and advanced embedded processing are being leveraged to enhance the efficiency, power density, and ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

Intelligent compaction (IC) technology represents a paradigm shift in pavement engineering by integrating advanced sensor systems, real‐time data processing and automated control to optimise ...

Malaysia's Penang state has served as a Southeast Asian technology hub for over five decades, hosting semiconductor operations since Intel established its presence in 1971. AMD, Renesas Electronics ...