Efinix high-performance Titanium field-programmable gate arrays (FPGAs) are custom-tailored for the computing demands of mainstream applications, targeting markets from intelligent edge devices to ...
More than ever, power integrity is vital in the successful creation of today's system-on-a-chip (SoC) designs. That's because e xcessive rail voltage drop ( IR drop) and ground bounce can create ...
Experts at the Table: Semiconductor Engineering sat down to discuss power integrity challenges and best practices in designs at 7nm and below, and in 2.5D and 3D-IC packages, with Chip Stratakos, ...
The CST PCB Studio power integrity solver is based on a special 3D FEM approach, that can calculate accurate impedance profiles within a full 3D simulation. The power integrity solver is integrated in ...
The Power Integrity Advance module ensures correct behavior of power distribution systems embedded within CADSTAR 13.0 design flow. It conducts EMC analysis and ac and dc power integrity analysis to ...
For system-on-a-chip designs at 90 and 65 nm, dynamic noise greatly exacerbates the challenge of timing signoff. To accurately examine noise effects, designers need tools that provide an accurate ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the new Cadence ® Voltus ™-XFi Custom Power Integrity Solution, a custom electromigration and IR drop (EM ...
Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
The new power integrity solution delivers an easy-to-use EM-IR flow, enabling full-chip verification SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the ...
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