Expands Advanced Packaging Platform Across Wafer-Level and Panel-Level Applications in Key Global Markets-FREMONT, Calif., Feb. 26, 2026 ...

FREMONT, Calif., Feb. 26, 2026 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced packaging applications, ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

FREMONT, Calif., May 08, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACMR) (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level ...

ACM Research, Inc ACMR reported fourth-quarter fiscal 2025 revenues of $244.43 million, beating the analyst consensus of $238.96 million. Revenues jumped 9.4% Y/Y. ACMR reported an adjusted EPS of 25 ...

CoreFlow Ltd. is proud to unveils its groundbreaking GripJet™ vacuum chuck, a revolutionary solution for advanced wafer-level packaging (AWLP) and other processes. By Eliminating the need for soft-pad ...

Advanced Chip Engineering (ACE), a wafer-level packaging and testing house which has investment from King Yuan Electronics Company (KYEC), suffered a fire on the second floor of a... STATS ChipPAC has ...

SJ Semiconductor's listing highlights the growing role of chip packaging in China's strategy to narrow the technology gap SJ ...

Advanced Chip Engineering Technology (ACE) has successfully run wafer-level packaging and testing for an 8-inch wafer of 64Mbit DRAM. The company has already acquired technical certification for its ...

Semiconductor machinery manufacturer Applied Materials (NASDAQ:AMAT) announced in Q4 CY2025, but sales fell by 2.1% year on year to $7.01 billion. On top of that, next quarter’s revenue guidance ...