HELSINKI, FINLAND – Incap has lowered its 2026 profit outlook, citing margin pressure in certain market segments and ongoing global material availability challenges, while maintaining its revenue ...

Featuring a fully shielded design, the BK35 hybrid FPC-to-board connector supports data transmission up to 40Gbps and RF signal transmission up to 40GHz while minimizing electromagnetic interference ...

TAIPEI, TAIWAN -- Global NAND Flash supply is expected to outpace demand in the second half of 2027, easing the supply constraints that have persisted throughout 2026, according to TrendForce.

Schweitzer Engineering Laboratories (SEL) has begun site preparation for a new electronic device manufacturing facility in Moscow, Idaho, representing a $50 million investment that will expand the ...

Available with new high-power (-HP) and ultra-high-power (-UP) options, the RMCA Series automotive grade thick-film chip resistors provide greater power density without increasing component footprint.

Designed for placement of the Hirose DF40C-80DP-0.4V female socket, the Custom Universal IL7 Nozzle (Part No. 2026-5682) features a 0.70 x 4.0 mm blade for secure handling during pick-and-place ...

EINDHOVEN, THE NETHERLANDS -- Keiron Printing Technologies has raised $24 million to accelerate commercialization of its laser-Induced forward transfer (LiFT) solder paste printing technology for ...

Combining 90W laser power with LPKF's Tensor Technology, the CuttingMaster 3290 laser depaneling system processes FR-4 substrates 2.4 mm thick and greater, along with ceramic, flex and rigid-flex ...

San Jose, CA -- Javad EMS (JEMS), a leading global EMS company that provides low to medium volume, high-mix applications, has added a SEHO PowerWave 3.0 wave solder system to its production floor, ...

Global semiconductor manufacturing equipment sales are expected to reach a record $165 billion in 2026, up 23% year over year, and climb to $229 billion by 2028, according to SEMI's Mid-Year Total ...

Featuring a fully shielded structure, the BK35 hybrid FPC-to-board connector supports data transmission up to 40Gbps and RF signal transmission up to 40GHz while minimizing EMI. The 0.35mm-pitch ...

Global smartphone shipments declined 6% year-over-year to 277 million units in the second quarter, according to IDC, as soaring memory costs continued to pressure lower-priced devices while premium ...