The BZPACK mSiC power modules leverage Microchip’s advanced mSiC technology, incorporating performance of its MB and MC SiC MOSFET families ...

Apex Microtechnology has announced the release of the MSA303, the latest member to its family of integrated power modules. The module utilizes silicon carbide MOSFET technology to improve efficiency ...

Power modules handle heat, moisture, and high voltage while making design easier and reducing failures. Learn more about ...

Designed to deliver fast, efficient ORing functionality in applications requiring power supply redundancy or parallel ...

Other part numbers will be available for sale sequentially.

ROHM Semiconductor U.S.A., LLC announced its participation at APEC 2026, the premier event for the power electronics ...

Infineon Technologies shares rose more than 3% on Friday after J.P. Morgan upgraded the German chipmaker to “overweight” from ...

DC power delivery board eliminates traditional 48V intermediate bus converter stage while improving system efficiency, ...

Microchip Technology has announced its BZPACK mSiC® power modules, designed to meet stringent High Humidity High Voltage High Temperature Reverse Bias ...

Navitas Semiconductor has announced its latest DC-DC power delivery board (PDB) enabling direct conversion from 800V to 6V in one power stage. The PDB is being shown at NVIDIA GTC ...

Diodes Incorporated has expanded its automotive power management lineup with the launch of the AL8859Q, a multi‑phase ...

Microchip Technology has announced its BZPACK mSiC power modules, designed to meet stringent High Humidity High Voltage High Temperature Reverse Bias (HV‑H3TRB) standards. The modules can deliver ...