IEEE

Crack Catcher AI — Enabling Smart Fracture Mechanics Approach for Damage Control in Thin Silicon Wafers for 3D Semiconductor Integrated Devices/Packages

Abstract: The importance of silicon cannot be undermined - in photovoltaics (PV) as well as in semiconductor industries. However, silicon is very brittle. Silicon cells/wafers crack easily during ...
C&EN

Crack Evolution and Failure Modes of Shale Containing a Pre-Existing Fissure under Compression

State Key Laboratory of Coal Mine Disaster Dynamics and Control, Chongqing University, Chongqing 400044, China School of Resources and Safety engineering, Chongqing University, Chongqing 400044, China ...
IEEE

Structural integrity optimization of 3D TSV package by analyzing crack behavior at TSV and BEOL

Abstract: New electronic devices with small size and low power consumption are in demand in recent years. Miniaturization and complex product are required in modern electronics for more functionality ...