Silver sintering die attach material is a bonding technology primarily used in the manufacturing of power devices and high-reliability electronic components, attracting attention as a next-generation ...

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The power electronics industry is facing a problem in that, as the power handled by transistors increases to meet the needs of new applications, the packaging will increasingly struggle to remove the ...

This provides a much better way to conduct heat away from the die and also increases reliability as the assembly process places less stress on the substrates, which is one of the biggest challenges ...

Abstract: This article describes the effect of adding copper oxide (CuO) nanoparticles into silver (Ag) nanopaste (NP) on the mechanical reliability of CuO/Ag sintering die attach by means of thermal ...

Abstract: Sintering as a means of die attach in power electronics modules shows advantages over solder connections with regards to reliability and ageing phenomena, especially at higher temperatures.