HELSINKI, FINLAND – Incap has lowered its 2026 profit outlook, citing margin pressure in certain market segments and ongoing global material availability challenges, while maintaining its revenue ...
Featuring a fully shielded design, the BK35 hybrid FPC-to-board connector supports data transmission up to 40Gbps and RF signal transmission up to 40GHz while minimizing electromagnetic interference ...
TAIPEI, TAIWAN -- Global NAND Flash supply is expected to outpace demand in the second half of 2027, easing the supply constraints that have persisted throughout 2026, according to TrendForce.
Schweitzer Engineering Laboratories (SEL) has begun site preparation for a new electronic device manufacturing facility in Moscow, Idaho, representing a $50 million investment that will expand the ...
Available with new high-power (-HP) and ultra-high-power (-UP) options, the RMCA Series automotive grade thick-film chip resistors provide greater power density without increasing component footprint.
EINDHOVEN, THE NETHERLANDS -- Keiron Printing Technologies has raised $24 million to accelerate commercialization of its laser-Induced forward transfer (LiFT) solder paste printing technology for ...
Designed for placement of the Hirose DF40C-80DP-0.4V female socket, the Custom Universal IL7 Nozzle (Part No. 2026-5682) features a 0.70 x 4.0 mm blade for secure handling during pick-and-place ...
Combining 90W laser power with LPKF's Tensor Technology, the CuttingMaster 3290 laser depaneling system processes FR-4 substrates 2.4 mm thick and greater, along with ceramic, flex and rigid-flex ...
Featuring a fully shielded structure, the BK35 hybrid FPC-to-board connector supports data transmission up to 40Gbps and RF signal transmission up to 40GHz while minimizing EMI. The 0.35mm-pitch ...
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